Delve into the automation evolution in packaging at PACK EXPO Chicago 2024
- Date: November 3-6, 2024
- Location: McCormick Place Convention Center, Chicago, Illinois
- Booth: Hall South N. S-2501
At Coesia, we understand the complexities of packaging and processing. Our expertise in industrial process automation and complex flow automation helps manufacturers meet these challenges efficiently. At our booth, you will have the opportunity to learn more about our digitally enhanced services, e-commerce, and sustainability, while having the chance to dive deep into industrial automation with our latest product launches and solutions.
LIVE DEMONSTRATIONS OF EXCITING NEW PRODUCTS
Hapa is presenting the newly launched blisterjet agile printing system: our most advanced, complexity-reducing, OEE-improving, user-friendly solution for late-stage customization. Experience this latest innovation during daily live presentations!
Don't miss this opportunity to see the future of packaging and processing automation. We look forward to meeting you and discussing how we can help streamline your operations.
Meet us
PACK EXPO Chicago 2024, November 3-6, 2024
McCormik Place Convention Center Chicago, Illinois
Hall South N. S-2501